Modern power electronics face constant pressure for higher power density and efficiency, requiring innovative approaches to thermal management. The development of new materials, such as wide-bandgap semiconductors (e.g., SiC and GaN), and the growing complexity of cooling applications like electric vehicles and renewable energy systems present both challenges and opportunities. Properly optimized design is key to enhancing reliability and extending the lifespan of power modules.
About the Seminar:
Join the CoolFusion 2025 Seminar, organized by TechSim Engineering, a leading Siemens partner in CEE, and the Institute of Electrical Engineering of the Slovak Academy of Sciences (IEE SAS). Gain insights into the latest trends in thermal simulations and testing for power electronics. Look forward to practical demonstrations, access to state-of-the-art IEE SAS laboratories, and discussions with industry experts.
Program Highlights:
- The latest Siemens-IEE SAS collaboration in power module testing
- Practical demonstrations of power module optimization and CFD simulations
- Tour of IEE SAS laboratories
- Success stories from the industry: 30% reduction in development costs, improved efficiency in EV systems, and much more
Date:
19 February 2025
List of speakers
Mike Fletcher
David Tompa
Juraj Čechovič
Mike Fletcher
With over 15 years of experience in thermal management and power electronics, Mike is a recognized expert in implementing innovative solutions in the industry.
David Tompa
As a senior engineer at Siemens, David specializes in the application of solutions for testing and analyzing power modules, with extensive experience in international projects.
Juraj Čechovič
Juraj works as a CFD analyst at TechSim Engineering, focusing on numerical simulations and contributing to innovations in thermal design and performance optimization for power electronics.
Institute of Electrical Engineering, Slovak Academy of Sciences
Dúbravská cesta 9
841 04 Bratislava
Slovakia
