Why to use?
Thermal Quality Assurance
The Simcenter Micred Quality Tester ensures thermal performance meets stringent standards, preventing defective semiconductor packages from reaching production.
Production-Integrated Testing
Designed for high-throughput environments, it supports rapid testing and binning directly on the manufacturing line.
Defect Detection and Sorting
Quickly identifies thermal anomalies like poor die attach, allowing for corrective action and consistent quality assurance.
Key Benefits
1. Detect Manufacturing Defects with Precision
Identify die attach issues and other thermal structure anomalies. Verify junction-to-case thermal resistance with built-in Simcenter Micred T3STER technology.
2. Streamline High-Throughput Testing
Perform accurate thermal impedance measurements using a short power pulse method. Achieve seamless integration with IC test handlers for fast and efficient device testing.
3. Automated Binning for Quality Control
Compare devices against a gold-standard thermal impedance curve. Automatically bin devices based on preset tolerances to ensure consistent quality.
TechSim Positioning
Precision in High-Volume Testing:
TechSim integrates Simcenter Micred Quality Tester solutions into your production environment, delivering fast and accurate thermal testing for large-scale semiconductor manufacturing.
Customizable and Scalable Solutions:
We provide tailored configurations to fit your production needs, ensuring seamless integration with existing IC test handlers and workflows.
Raising Industry Standards:
With expertise in thermal testing and automation, TechSim helps you achieve reliable, repeatable results that elevate your quality assurance practices to meet or exceed industry benchmarks.
