Why to use?
Comprehensive Thermal Testing
Simcenter Micred T3STER enables precise thermal testing and characterization for semiconductor IC packages, LEDs, power electronics, and stacked multi-die devices. It simplifies thermal diagnostics, from development to production.
Simulation Model Calibration
Leverage thermal measurement data to create compact or detailed thermal models, ensuring reliability and accuracy in simulation-based design efforts.
Design Optimization
Identify weak points in heat flow paths and improve material choices, package designs, or assembly processes for enhanced thermal performance and durability.
Key Benefits
1. Achieve 99+% Simulation Accuracy
Capture highly precise thermal transient responses with ±0.01°C accuracy and 1-microsecond resolution. Export data to calibrate 3D thermal models in Simcenter Flotherm for unmatched predictive performance.
2. Test Any Semiconductor Package Efficiently
Analyze a wide range of devices, including diodes, BJTs, power MOSFETs, IGBTs, power LEDs, and multi-die packages. Perform in situ testing with electrical connections for powering and sensing, eliminating redundant tests.
3. Diagnose Thermal Issues Rapidly
Generate structure functions to detect features like die attach quality and identify thermal resistance across the heat flow path. Enable pre- and post-stress failure detection with reproducible, single-test measurements.
TechSim Positioning
Unmatched Expertise in Electronics Testing:
TechSim provides seamless integration of Simcenter Micred T3STER into your workflow, ensuring reliable thermal characterization and efficient model calibration.
Tailored Solutions for Industry Needs:
We offer end-to-end support for electronic thermal testing, from hardware setup to advanced simulation, addressing challenges across industries like automotive, semiconductors, and power electronics.
Accelerating Design and Production:
Our expertise enables faster, more accurate testing processes, helping clients achieve superior thermal performance while reducing development risks.
Simcenter T3STER capabilities
Transient thermal testing
Our thermal characterization solutions empower component and system suppliers to accurately and efficiently assess semiconductor packages, LEDs, multi-die stacks, power electronics, TIM properties, and complete electronic systems. By capturing real-time thermal transient responses, our hardware delivers precise thermal metrics with greater efficiency than traditional steady-state methods—eliminating the need for repeated measurements.
