Why to use?
Thermal Architecture Exploration
Quickly evaluate design alternatives at the IC package, PCB, and enclosure levels to guide thermal management strategies.
Electronics Cooling Simulation
Optimize heatsink designs, fan placements, and cooling strategies to ensure reliable performance under varying conditions.
System-Level Thermal Modeling
Use BCI-ROMs for rapid, accurate thermal simulations in complex systems like data centers and automotive electronics.
Early Design Validation
Eliminate late-stage redesigns by identifying thermal issues and optimizing cooling solutions early in the design process.
Key Benefits
1. Accelerate Electronics Cooling Design – Shorten Time by Up to 50%
Use SmartParts and extensive libraries to quickly build thermal models for early design exploration. Eliminate re-gridding delays with object-associated meshing for iterative design refinement.
2. Optimize Thermal Performance – Identify Issues Early
Perform accurate transient thermal analysis to model power cycles, operational transitions, and cooling strategies. Use PCB thermal analysis visualization to pinpoint failing components for remedial action.
3. Enhance Collaboration Across Teams – Seamless EDA and CAD Integration
Import board layouts and routing data from major EDA tools via EDA Bridge. Integrate mechanical design data to build high-fidelity models for complex assemblies.
4. Boost Simulation Efficiency – Solve 40,000x Faster with BCI-ROM Technology
Generate reduced-order models for system-level simulations without compromising accuracy. Export BCI-ROMs for use in tools like Simcenter Amesim, Simulink, and Xpedition AMS.
TechSim Positioning
Your Partner in Electronics Thermal Design:
TechSim helps integrate Simcenter Flotherm into your development process, ensuring efficient thermal simulations tailored to your needs.
Optimizing Complex Workflows:
Our expertise ensures you can leverage SmartParts, transient analysis, and BCI-ROM technology to achieve reliable designs faster.
Driving Innovation Across Industries:
From consumer electronics to data centers, TechSim supports cutting-edge thermal management solutions with expert guidance and tailored configurations.
Key Capabilities and Differentiators
1. Transient Thermal Analysis:
Model time-dependent behaviors like power dissipation, fan control, and thermal mitigation strategies with high accuracy and sub-microsecond time resolution.
2. Robust Cartesian Meshing:
Leverage structured Cartesian meshing tailored for electronics cooling. SmartPart-based grid generation automatically updates for geometry changes, eliminating manual rework.
3. Intelligent Modeling with SmartParts:
Use pre-configured components like heatsinks, fans, and enclosures for rapid model construction, supporting design decisions from concept to verification.
4. EDA and CAD Data Integration:
Import ECAD data seamlessly to enhance model fidelity with board layout and routing details. Incorporate mechanical CAD for comprehensive thermal simulations.
5. BCI-ROM Technology:
Export Boundary Condition Independent Reduced Order Models for fast, system-level transient simulations across a variety of thermal environments.
